Abstract

Research Article

Failure-oriented-accelerated-testing (FOAT) and its role in assuring electronics reliability: review

E Suhir*

Published: 06 January, 2023 | Volume 6 - Issue 1 | Pages: 001-018

A highly focused and highly cost-effective failure-oriented-accelerated-testing (FOAT) suggested about a decade ago as an experimental basis of the novel probabilistic design for reliability (PDfR) concept is intended to be carried out at the design stage of a new electronic packaging technology and when high operational reliability (like the one required, e.g., for aerospace, military, or long-haul communication applications) is a must. On the other hand, burn-in-testing (BIT) that is routinely conducted at the manufacturing stage of almost every IC product is also of a FOAT type: it is aimed at eliminating the infant mortality portion (IMP) of the bathtub curve (BTC) by getting rid of the low reliability “freaks” prior to shipping the “healthy” products, i.e., those that survived BIT, to the customer(s). When FOAT is conducted, a physically meaningful constitutive equation, such as the multi-parametric Boltzmann-Arrhenius-Zhurkov (BAZ) model, should be employed to predict, from the FOAT data, the probability of failure and the corresponding useful lifetime of the product in the field, and, from the BIT data, as has been recently demonstrated, - the adequate level and duration of the applied stressors, as well as the (low, of course) activation energies of the “freaks”. Both types of FOAT are addressed in this review using analytical (“mathematical”) predictive modeling. The general concepts are illustrated by numerical examples. It is concluded that predictive modeling should always be conducted prior to and during the actual testing and that analytical modeling should always complement computer simulations. Future work should be focused on the experimental verification of the obtained findings and recommendations.

Read Full Article HTML DOI: 10.29328/journal.ijpra.1001048 Cite this Article Read Full Article PDF

Keywords:

Accelerated life testing (ALT); Bathtub curve (BTC); Boltzmann-arrhenius-zhurkov (BAZ) equation; Burn-in-testing (BIT); Failure-oriented-accelerated-testing (FOAT); Highly accelerated life testing (HALT); Infant-mortality-portion (IMP); Probabilistic design for reliability (PDfR)

References

  1. Van Rossum M. The Future of Microelectronics: Evolution or Revolution? Microelectronic Engineering. 1996; 34(1).
  2. Chatterjee PK, Doering RR. The Future of Microelectronics. Proc IEEE. 1998; 86(1).
  3. Suhir E. The Future of Microelectronics and Photonics and the Role of Mechanics and Materials. ASME J Electr Packaging (JEP). 1998.
  4. The Future of Microelectronics. Nature. 2000; 406:1021. https://doi.org/10.1038/35023221
  5. Suhir E. Microelectronics and Photonics – the Future. Microelectronics Journal. 2000; 31.
  6. Suhir E. Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests. ASME J Electr Packaging (JEP). 2002; 124(3).
  7. Duane JT, Collins DH, Jason K, Freels JK, Huzurbazar AV, Warr RL, Brian P, Weaver BP. Accelerated Test Methods for Reliability Prediction. IEEE Trans Aerospace. 1964; 2.
  8. Nelson WB. Accelerated Testing: Statistical Models. Test Plans and Data Analysis, John Wiley, Hoboken, NJ 1990.
  9. Matisoff B. Handbook of Electronics Manufacturing Engineering, 3rd ed., Prentice Hall, 1994.
  10. Ebeling C. An Introduction to Reliability and Maintainability Engineering, McGraw-Hill, 1997.
  11. Katz A, Pecht M, Suhir E. Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments. Proc of the Int Symp on Microelectronics and Packaging. IMAPS-Israel, 2000.
  12. Suhir E. Reliability and Accelerated Life Testing. Semiconductor International. 2005. 1.
  13. Suhir E, Mahajan R. Are Current Qualification Practices Adequate?. Circuit Assembly. 2011.
  14. Suhir E, Yi S. Accelerated Testing and Predicted Useful Lifetime of Medical Electronics, IMAPS Conf. on Advanced Packaging for Medical Electronics, San-Diego, 2017.
  15. Suhir E. Making a Viable Electron Device into a Reliable Product: Brief Review, Brief Note. Journal of Electronics & Communications. 1(5).
  16. Kececioglu D, Sun FB. Burn-in-Testing: Its Quantification and Optimization.; Prentice Hall: Upper Saddle River, NJ, USA, 1997.
  17. Vollertsen RP, Burn-In, IEEE Int. Integrated Reliability Workshop, USA, 1999.
  18. Burn-In. MIL-STD-883F: Test Method Standard, Microchips. Method 1015.9; US DoD: Washington, DC, USA, 2004.
  19. Noel M, Dobbin A, Van Overloop D. Reducing the Cost of Test in Burn-in - An Integrated Approach, Archive: Burn-in and Test, Socket Workshop, Mesa, USA, 2004.
  20. Ooi MPL, Abu Kassim Z, Demidenko S. Shortening Burn-In Test: Application of HVST Weibull Statistical Analysis. IEEE Transactions. On I&M. 2007; 56(3).
  21. Ng YH, Low Y, Demidenko SN. Improving Efficiency of IC Burn-In Testing, IEEE Instrumentation and Measurement Technology Conference Proc. 2008.
  22. Suhir E. To Burn-in, or not to Burn-in: That’s the Question. Aerospace. 2019; 6(3).
  23. Suhir E. Burn-in Testing (BIT): Is It Always Needed?. IEEE ECTC, Orlando, Fl. 2020.
  24. Suhir E. Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies. 42-nd ECTC, San-Diego, Calif. 1992.
  25. Suhir E. Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable IC Package into a Reliable Product, Circuits Assembly. 2013.
  26. Suhir E. Could Electronics Reliability Be Predicted, Quantified and Assured? Microelectronics Reliability, No. 53, April 15, 2013
  27. Suhir E, Bensoussan A, Nicolics J, Bechou L. Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product. 2014 IEEE Aerospace Conference, Big Sky, Montana.
  28. Suhir E. Failure-Oriented-Accelerated-Testing (FOAT), Boltzmann-Arrhenius-Zhurkov Equation (BAZ) and Their Application in Microelectronics and Photonics Reliability Engineering. Int J of Aeronautical Sci Aerospace Research (IJASAR). 2019; 6(3).
  29. Suhir E, Ghaffarian R. Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure. Journal of Electronic Materials. 2019; 48.
  30. Suhir E. Applied Probability for Engineers and Scientists, McGraw-Hill, New York, 1997.
  31. Suhir E. Probabilistic Design for Reliability. ChipScale Reviews. 2010; 14(6).
  32. Suhir E. Remaining Useful Lifetime (RUL): Probabilistic Predictive Model. International Journal of PHM. 2011; 2(2).
  33. Suhir E, Mahajan R, Lucero A, Bechou L. Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT). 2012 IEEE/AIAA Aerospace Conf. Big Sky, Montana, 2012.
  34. Suhir E. Assuring Aerospace Electronics and Photonics Reliability: What Could and Should Be Done Differently, 2013 IEEE Aerospace Conference, Big Sky, Montana.
  35. Suhir E. Considering Electronic Product’s Quality Specifications by Application(s), ChipScale Reviews. 2012; 16.
  36. Suhir E, Probabilistic Design for Reliability of Electronic Materials, Assemblies, Packages and Systems: Attributes, Challenges, Pitfalls, Plenary Lecture, MMCTSE 2017, Cambridge, UK, Feb. 24-26, 2017.
  37. Suhir E, Ghaffarian R. Solder Material Experiencing Low Temperature Inelastic Thermal Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime, Journal of Materials Science: Materials in Electronics. 2017; 28(4).
  38. Suhir E. Probabilistic Design for Reliability (PDfR) of Aerospace Instrumentation: Role, Significance, Attributes, Challenges, 5th IEEE Int. Workshop on Metrology for Aerospace (MetroAeroSpace), Rome, Italy, Plenary Lecture, June 20-22, 2018.
  39. Suhir E. Physics of Failure of an Electronics Product Must Be Quantified to Assure the Product's Reliability, Editorial, Acta Scientific Applied Physics. 2021; 2(1).
  40. Suhir E. Remaining Useful Lifetime (RUL): Probabilistic Predictive Model, Int. J. of Prognostics-and-Health-Monitoring (PHM). 2011.
  41. Suhir E. Could Electronics Reliability Be Predicted, Quantified and Assured? Microelectronics Reliability. No. 53, 2013.
  42. Suhir E. Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics. Chip Scale Reviews. 2011; 15(4).
  43. Suhir E. Electronic Product Qual Specs Should Consider Its Most Likely Application(s), ChipScale Reviews. 2012.
  44. Suhir E. When Reliability is Imperative, Ability to Quantify It is a Must, IMAPS Advancing Microelectronics. 2013.
  45. Suhir E. Predicted Reliability of Aerospace Electronics: Application of Two Advanced Probabilistic Techniques, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013.
  46. Suhir E. Statistics and Reliability-Physics-Related Failure Processes. Modern Physics Letters B (MPLB). 2014; 28. 2014
  47. Suhir E. Analytical Bathtub Curve with Application to Electron Device Reliability. Journal of Materials Science: Materials in Electronics. 2015; 26.
  48. Suhir E, Bensoussan A. Degradation Related Failure Rate Determined from the Experimental Bathtub Curve. SAE Conf. Seattle, WA, Sept. 22-24, 2015.
  49. Silverman M. Forty Years of HALT: What Have We Learned? IEEE EPS ASTR 2012 Oct 17-19, Toronto, CA 2012.
  50. Fundamentals of HALT/HASS Testing(PDF). Keithley Instruments, Inc. Cleveland, Ohio. 2000.
  51. What is HALT HASS: Performing HALT. Qualmark Corporation. March 1, 2012. Retrieved 10 June2012.
  52. Doertenbach N. The Application of Accelerated Testing Methods and Theory (HALT and HASS). QualMark Corporation. 2012-03-01.
  53. Boltzmann L. About the mechanical meaning of the second law of the theory of heat, scientific treatises, Wiener Berichte. 1866; 53 (in German).
  54. Boltzmann L. Studies on the balance of living force between moving material points. Vienna reports. 1868; 58 (in German).
  55. Boltzmann L. The Second Law of Thermodynamics. Populare Schriften, Essay 3, Address to a Formal Meeting of the Imperial Academy of Science. 29 May 1886.
  56. Arrhenius S. Research on the galvanic conductivity of electrolytes, Doctoral Dissertation, Stockholm, Royal Publishing House. PA Norstedt & Söner. 1884.
  57. Arrhenius S. On the heat of dissociation and the influence of temperature on the degree of dissociation of the electrolytes. Z. Phys. Chem. 1889; 4.
  58. Zhurkov SN. “Проблема прочности твёрдых тел” (The Problem of the Strength of Solids), Journal Acad. Nauk SSSR (Bulletin of the USSR Academy of Sciences). 1957; 11.
  59. Zhurkov SN. Kinetic Concept of the Strength of Solids, Int. J. of Fracture. 1965; 1:4.
  60. Suhir E, Kang S. Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems, Modern Physics Letters B (MPLB). 2013; 27.
  61. Suhir E, Bechou L, Bensoussan A. Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model. Circuit Assembly. Dec 3, 2012.
  62. Suhir E, Bensoussan A. Application of Multi-Parametric BAZ Model in Aerospace Optoelectronics. 2014 IEEE Aerospace Conference. Big Sky, Montana. March 2014.
  63. Suhir E. Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure-Based Equation Sandwiched Between Two Statistical Models. Microelectronics Reliability. Oct 2014.
  64. Suhir E. Static Fatigue Lifetime of Optical Fibers Assessed Using Boltzmann-Arrhenius-Zhurkov (BAZ) Model. Journal of Materials Science: Materials in Electronics. 2017; 28(16).
  65. Ponomarev A, Suhir E. Predicted Useful Lifetime of Aerospace Electronics Experiencing Ionizing Radiation: Application of BAZ Model. Journal of Aerospace Engineering and Mechanics (JAEM). 2019; 3(1).
  66. Suhir E. Boltzmann-Arrhenius-Zhurkov Equation and Its Applications in Electronic-and-Photonic Aerospace Materials Reliability-Physics Problems. Int. Journal of Aeronautical Science and Aerospace Research (IJASAR). March 24, 2020.
  67. Suhir E, Stamenkovic Z. Using Yield to Predict Long-Term Reliability of Integrated Circuit (IC) Devices: Application of Boltzmann-Arrhenius-Zhurkov (BAZ) Model. Solid-State Electronics. Feb. 2020; 164.
  68. Suhir E. Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques. ASME Journal of Electronic Packaging. June 1989; 111.
  69. Suhir E. Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief Review. Special Issue, ASME J. Electr. Packaging (JEP). June 2003; 125: 2.
  70. Suhir E. Analytical Thermal Stress Modeling in Electronic and Photonic Systems. ASME Applied Mechanics Reviews. 2009; 62(4).
  71. Suhir E. Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them. IMAPS Advanced Microelectronics. July/August 2011; 38: 4.
  72. Suhir E. Could Electronics Reliability Be Predicted, Quantified and Assured? Microelectronics Reliability. July 2013; 53: 7.
  73. Suhir E. Analytical Modeling Enables Explanation of Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products: Review. Journal of Physical Mathematics. 2015; 7(1).
  74. Suhir E. Analytical Modeling Occupies a Special Place in the Modeling Effort. Short Comm. Journal of Physical Mathematics. 2016; 7(1).
  75. Hall PM. Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards. IEEE CHMT Transactions. Dec 1984; 7(4).
  76. Suhir E. Mechanical Reliability of Flip-Chip Interconnections in Silicon-on-Silicon Multichip Modules. IEEE Conference on Multichip Modules, IEEE, Santa Cruz. Calif. March 1993.
  77. Suhir E. Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen. Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM). 2011; 91(5).
  78. Suhir E. Low-Cycle-Fatigue Failures of Solder Material in Electronics: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review. Journal of Aerospace Engineering and Mechanics. 2018; 2(1).
  79. Gopalakrishna H, Sinha A, Jordan D, Tamizhmani G. Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures. IEEE 46th Photovoltaic Specialists Conference, PVSC, Chicago, US. June 16-21, 2019.
  80. Suhir E, Ghaffarian R. Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure. Journal of Electronic Materials. 2019; 48(2).
  81. Suhir E. Twist-off Testing of Solder Joint Interconnections. ASME J. Electr. Packaging (JEP). Sept 1989; 111(3).
  82. Zhang Y, Suhir E, Xu Y, Gu C. Bonding Strength of Carbon Nanofiber Array to its Substrate. JMR. Nov 2006; 21(11).
  83. Suhir E. Bonded Tri-Material Specimen Subjected to Shear-Off Testing: Predicted Interfacial Stresses. Journal of Aerospace Engineering and Mechanics (JAEM). 2020; 4(1).
  84. Suhir E. Bi-Material Assembly Subjected to Thermal Stress: Propensity to Delamination Assessed Using Interfacial Compliance Model. Journal of Materials Science: Materials in Electronics. 2016; 27(7).
  85. Suhir E, Morris J, Wang L, Yi S. Could the Dynamic Strength of a Bonding Material in an Electronic Device Be Assessed from Static Shear-Off Test Data?. Journal of Materials Science: Materials in Electronics. 2016; 27(7).
  86. Suhir E. Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product? IEEE CPMT Transactions. Part A. Dec 1997; 20(4).
  87. Zhou CY, Yu TX, Suhir E. Design of Shock Table Tests to Mimic Real-Life Drop Conditions. IEEE CPMT Transactions. 2009; 32(4).
  88. Suhir E, Shakouri A. Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module (TEM) Design? ASME J. Appl. Mech. 2012; 79(6).
  89. Suhir E, Shangguan D, Bechou L. Predicted Thermal Stresses in a Tri-Material Assembly with Application to Silicon-Based Photovoltaic Module. ASME J. Appl. Mech. March 2013; 80.
  90. Suhir E, Bechou L, Levrier B. Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly. ASME J. Appl. Mech. March 2013; 80.
  91. Suhir E, Analysis of a Short Beam with Application to Solder Joints: Could Larger Stand-off Heights Relieve Stress? European Journal of Applied Physics (EPJAP). 2015; 71.
  92. Suhir E, Ghaffarian R, Nicolics J. Could Application of Column-Grid-Array Technology Result in Inelastic-Strain-Free State-of-Stress in Solder Material? Journal of Materials Science: Materials in Electronics. 2015; 26(12).
  93. Suhir E, Ghaffarian R. Column-Grid-Array (CGA) vs. Ball-Grid-Array (BGA): Board-Level Drop Test and the Expected Dynamic Stress in the Solder Material. Journal of Materials Science: Materials in Electronics. 2016; 27 (11).
  94. Suhir E, Bechou L. Availability Index and Minimized Reliability Cost. Circuit Assemblies, Feb 2013.
  95. Suhir E. Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints. ASME J. of Appl. Mech. 1989; 56(2).
  96. Suhir E, Ghaffarian R. Solder Material Experiencing Low Temperature Inelastic Thermal Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime” Journal of Materials Science: Materials in Electronics. 2017; 28(4).
  97. Suhir E, Poborets B. Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability. ASME J Electr. Packaging (JEP). 1990; 112:2.
  98. Suhir E, Raskin Y, Tunik A. Russian Strength Standards for Commercial Ships. American Bureau of Shipping. 1982
  99. Suhir E. Probabilistic Methods in Structural Analysis and Vibration of Ships («Вероятностные Методы в Строительной Механике и Вибрации Корабля»), Institute of Naval Architecture, Nikolayev. Ukraine. 1974.
  100. Gradshteyn IS, Ryzhik IM. Tables of Integrals, Series, and Products. Academic Press. 1980.

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